{
    "content-origin" "NIST IPRP (https://www.ctcms.nist.gov/potentials/Al.html#Al-Cu)" 
    "content-other-locations" "http://enpub.fulton.asu.edu/cms/potentials/main/main.htm" 
    "contributor-id" "360c0aed-48ce-45f6-ba13-337f12a531e8" 
    "description" "EAM potential for the Al-Cu system developed by Liu et al. (1999). The potential was used to study electromigration in Al-Cu interconnects." 
    "developer" [
        "7fbb3530-c1f7-4345-b014-9df287812ba3" 
        "6cc67fa6-ad95-45ef-b042-523034248152" 
        "ba72d8e2-f5fb-4a80-9802-d83599b2d981"
    ] 
    "doi" "10.25950/2dd77629" 
    "domain" "openkim.org" 
    "extended-id" "EAM_Dynamo_LiuLiuBorucki_1999_AlCu__MO_020851069572_000" 
    "kim-api-version" "2.0" 
    "maintainer-id" "360c0aed-48ce-45f6-ba13-337f12a531e8" 
    "model-driver" "EAM_Dynamo__MD_120291908751_005" 
    "potential-type" "eam" 
    "publication-year" "2018" 
    "source-citations" [
        {
            "author" "Liu, X.-Y and Liu, C.-L and Borucki, L.J" 
            "doi" "10.1016/S1359-6454(99)00186-X" 
            "journal" "Acta Materialia" 
            "number" "11" 
            "pages" "3227 - 3231" 
            "recordkey" "MO_020851069572_000a" 
            "recordprimary" "recordprimary" 
            "recordtype" "article" 
            "title" "A new investigation of copper's role in enhancing Al\u2013Cu interconnect electromigration resistance from an atomistic view" 
            "volume" "47" 
            "year" "1999"
        }
    ] 
    "species" [
        "Al" 
        "Cu"
    ] 
    "title" "EAM potential (LAMMPS cubic hermite tabulation) for the Al-Cu system developed by Liu et al. (1999) v000"
}