{"creator" "Sang-Pil Kim"
 "contributor-id" "66854aaa-7f4c-496a-b76a-8a51065fef50"
 "description" "EAM, Al-Cu alloy, Al3Cu, AlCu3 considered, deposition and thin film growth simulation"
 "domain" "openkim.org"
 "extended-id" "EAM_Dynamo_Cai_Ye_AlCu__MO_942551040047_004"
 "kim-api-version" "1.6"
 "maintainer-id" "66854aaa-7f4c-496a-b76a-8a51065fef50"
 "model-driver" "EAM_Dynamo__MD_120291908751_004"
 "publication-year" "2018"
 "source-citations" [{"author" "Kim, S.-P. and Lee, K.-R. and Chung, Y.-C. and Sahashi, M. and Kim, Y. K."
                      "doi" "10.1063/1.3142382"
                      "journal" "Journal of Applied Physics"
                      "number" "11"
                      "pages" "114312"
                      "recordkey" "MO_942551040047_004a"
                      "recordtype" "article"
                      "title" "Molecular dynamics simulation study of deposition and annealing behaviors of {Al} atoms on {Cu} surface"
                      "volume" "105"
                      "year" "2009"}]
 "species" ["Al" "Cu"]
 "title" "EAM potential for Al-Cu binary system"}