| Title
A single sentence description.
|
Linear thermal expansion coefficient of fcc Au at 293.15 K under a pressure of 0 MPa v002 |
|---|---|
| Description | Linear thermal expansion coefficient of a fcc lattice of Au atoms at a temperature of 293.15 K under a pressure of 0 MPa. |
| Species
The supported atomic species.
| Au |
| Disclaimer
A statement of applicability provided by the contributor, informing users of the intended use of this KIM Item.
|
None |
| Contributor |
Mingjian Wen |
| Maintainer |
Mingjian Wen |
| Developer |
Mingjian Wen Claire Waters |
| Published on KIM | 2024 |
| How to Cite |
This Test is archived in OpenKIM [1-4]. [1] Wen M, Waters C. Linear thermal expansion coefficient of fcc Au at 293.15 K under a pressure of 0 MPa v002 [Internet]. OpenKIM; 2024. Available from: https://openkim.org/cite/TE_173429922932_002 [2] Wen M, Waters C. Linear thermal expansion coefficient of cubic crystal structures v002. OpenKIM; 2024. doi:10.25950/9d9822ec [3] Tadmor EB, Elliott RS, Sethna JP, Miller RE, Becker CA. The potential of atomistic simulations and the Knowledgebase of Interatomic Models. JOM. 2011;63(7):17. doi:10.1007/s11837-011-0102-6 [4] Elliott RS, Tadmor EB. Knowledgebase of Interatomic Models (KIM) Application Programming Interface (API). OpenKIM; 2011. doi:10.25950/ff8f563a Click here to download the above citation in BibTeX format. |
| Funding | Not available |
| Short KIM ID
The unique KIM identifier code.
| TE_173429922932_002 |
| Extended KIM ID
The long form of the KIM ID including a human readable prefix (100 characters max), two underscores, and the Short KIM ID. Extended KIM IDs can only contain alpha-numeric characters (letters and digits) and underscores and must begin with a letter.
| LinearThermalExpansionCoeff_fcc_Au__TE_173429922932_002 |
| Citable Link | https://openkim.org/cite/TE_173429922932_002 |
| KIM Item Type | Test |
| Driver | LinearThermalExpansionCoeffCubic__TD_522633393614_002 |
| Properties
Properties as defined in kimspec.edn.
These properties are inhereted from the Test Driver.
| |
| KIM API Version | 2.3.0 |
| Simulator Name
The name of the simulator as defined in kimspec.edn.
This Simulator Name is inhereted from the Test Driver.
| LAMMPS |
| Programming Language(s)
The programming languages used in the code and the percentage of the code written in each one.
| 100.00% Python |
| Previous Version | LinearThermalExpansionCoeff_fcc_Au__TE_173429922932_001 |
| Model | Test Results | Link to Test Results page | Benchmark time
Usertime multiplied by the Whetstone Benchmark. This number can be used (approximately) to compare the performance of different models independently of the architecture on which the test was run.
Measured in Millions of Whetstone Instructions (MWI) |
|---|---|---|---|
| EAM_QuinticClampedSpline_Kim_2021_PtAu__MO_463728687265_001 | view | 652866 |
| LinearThermalExpansionCoeff_fcc_Au__TE_173429922932_002.txz | Tar+XZ | Linux and OS X archive |
| LinearThermalExpansionCoeff_fcc_Au__TE_173429922932_002.zip | Zip | Windows archive |
This Test requires a Test Driver. Archives for the Test Driver LinearThermalExpansionCoeffCubic__TD_522633393614_002 appear below.
| LinearThermalExpansionCoeffCubic__TD_522633393614_002.txz | Tar+XZ | Linux and OS X archive |
| LinearThermalExpansionCoeffCubic__TD_522633393614_002.zip | Zip | Windows archive |